JPH0546276Y2 - - Google Patents
Info
- Publication number
- JPH0546276Y2 JPH0546276Y2 JP15990786U JP15990786U JPH0546276Y2 JP H0546276 Y2 JPH0546276 Y2 JP H0546276Y2 JP 15990786 U JP15990786 U JP 15990786U JP 15990786 U JP15990786 U JP 15990786U JP H0546276 Y2 JPH0546276 Y2 JP H0546276Y2
- Authority
- JP
- Japan
- Prior art keywords
- sealing resin
- chip
- printed circuit
- circuit board
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 238000007789 sealing Methods 0.000 claims description 26
- 239000011241 protective layer Substances 0.000 claims description 12
- 230000000694 effects Effects 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15990786U JPH0546276Y2 (en]) | 1986-10-18 | 1986-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15990786U JPH0546276Y2 (en]) | 1986-10-18 | 1986-10-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365243U JPS6365243U (en]) | 1988-04-30 |
| JPH0546276Y2 true JPH0546276Y2 (en]) | 1993-12-03 |
Family
ID=31084781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15990786U Expired - Lifetime JPH0546276Y2 (en]) | 1986-10-18 | 1986-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0546276Y2 (en]) |
-
1986
- 1986-10-18 JP JP15990786U patent/JPH0546276Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6365243U (en]) | 1988-04-30 |
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